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Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

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China Chips Star Semiconductor Co., Ltd.

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Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Brand Name : PG

Place of Origin : Shenzhen, China

Price : Negotiable

Payment Terms : L/C,T/T

Supply Ability : 100K a month

Delivery Time : 10 to 15 days

Read Speed : 330MB/s

Logo Customized Service : Available

Material : Plastic

Quality : Good

Product name : Automotive Embedded Multi Media Card

Origin : China

Model Number : G2864TLCA/ G28128TLCA/ G28256TLCA

Package : BGA153 Package

MOQ : 50pcs

Capacity Options : 64GB, 128GB, 256GB

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Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Automotive-grade eMMC is an embedded non-volatile memory chip specifically engineered for the demanding environments of automotive electronics. Utilizing the BGA 153 package, this solution integrates NAND flash, controller, and MMC interface into a single chip, fully compliant with automotive standards including AEC-Q100. With core advantages of high reliability, wide temperature resistance, extended durability, and robust protection, it serves as a critical storage solution for multiple applications in intelligent vehicles.

Technical Specifications

Interface	eMMC 5.1 with HS400 support
Capacities	64GB, 128GB, 256GB
Data Transfer Speed	Up to 400MB/s (HS400 mode)
Operating Voltage	3.3V (VCC), 1.8V/3.3V (VCCQ)
Temperature Range	-40°C to 105°C
Endurance	High endurance for frequent read/write cycles
Security	RPMB, secure boot, and write protection
Package	BGA (Ball Grid Array)
Package Size	11.5 x 13 x 1 mm

Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Core Technologies and Reliability Design

Automotive Certification and Wide Temperature Adaptation

Complies with AEC-Q100 Grade2 (-40℃~105℃) and adapts to temperature variations across automotive environments including engine compartments and cockpits. Certified with IATF16949 quality management standards.

Performance and Power Consumption Optimization

Adheres to JEDEC eMMC 5.1 protocol with HS400 high-speed mode support, delivering sequential read/write speeds up to 330/240MB/s. Features intelligent low-power algorithms and FBA acceleration technology to balance high performance with efficient power consumption.

Packaging and Adaptability

Utilizes 153-ball FBGA package (11.5*13*1mm dimensions). The on-board soldering method enhances vibration resistance, enabling adaptation to the limited space and impact resistance requirements of automotive electronics. Available in capacities ranging from 64GB to 256GB.

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Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component

Embedded Multi Media Card

BGA 153 Flash eMMC

IC Component eMMC 5.1

Automotive Embedded Multi Media Card Endurable eMMC BGA 153 Flash IC Component Images